Overview

The Inspection System is a high-precision, intelligent solution designed to ensure superior quality control throughout the PCB production process. It is ideal for applications including after stencil printing, pre- and post-reflow oven inspection, wave soldering, and FPC verification. Equipped with advanced machine learning algorithms, color calculation, grayscale operation, and image contrast analysis, the system detects a wide range of defects such as missing or misaligned components, solder bridging, empty solder joints, scratches, stains, and incorrect or damaged parts. The optical system features high-speed industrial cameras up to 20MP with customizable lens resolutions and multi-channel annular lighting, ensuring accurate inspection of even the smallest components down to 01005 chips and 0.3 mm pitch ICs. The mechanical system provides precise PCB handling with servo-driven XY movement, high-speed positioning, and support for boards up to 400×360 mm, with adjustable component heights and weights up to 3 kg. Integrated SPC functions allow full data recording and analysis to monitor production quality in real-time, while optional features such as maintenance stations, offline programming, and barcode systems enhance flexibility and efficiency. Designed with CE safety standards and adaptable to various production environments, this system seamlessly connects with other SMT equipment, delivering reliable, automated inspection that maximizes accuracy and throughput.