REFLOW OVEN
"Where Heat Meets Precision — Creating Flawless Solder Joints."
ETS - Top 8 Zone & Bottom 8 Zone Reflow Oven
ETS - Top 8 Zone & Bottom 8 Zone Reflow Oven
Overview
The ETS-RFO835L is a high-performance 16-zone reflow oven designed for stable, uniform, and repeatable SMT soldering. With full hot-air heating, precise temperature control, and efficient forced-air cooling, it ensures reliable solder joints for high-quality PCB assembly while maintaining low operating power.
- 16 Heating Zones (Top 8 + Bottom 8) for excellent thermal uniformity.
- Full Hot-Air Heating ensures consistent soldering across the PCB.
- High Precision Temperature Control (±1°C accuracy & distribution).
- Industrial PC + PLC Control for stable and reliable operation.
- Mesh + Chain Conveyor System for smooth PCB transport.
- Wide PCB Support up to 350 mm.
- Energy-Efficient Operation with low working power consumption.
- Fast Warm-Up Time (15–20 minutes).
- Forced Air Cooling Zone for controlled PCB cooling.
- Built-in Safety Alarms for temperature abnormalities.
| Parameter | Details |
|---|---|
| Model | : ETS-RFO835L |
| Heating Zone | : Upper 8 / Down 8 zones |
| Heating Method | : Full hot air |
| Cooling Zone | : 1 Zone |
| Cooling Method | : Forced Air Cooling |
| Max. PCB Width | : 350mm |
| Mesh Width | : 350mm |
| Transmission Belt Height | : 880 ± 20mm |
| Transmission Speed | : 0–2000mm/min |
| Transmission Type | : Mesh + Chain Guiderail |
| Transport Direction | : Left→right (right→left optional) |
| Power | : 3-phase 380V |
| Starting Power | : 30KW |
| Working Power | : Approx 5KW |
| Warm-up Time | : about 15–20 minutes |
| Temperature Range | : Room temperature to 400℃ |
| Temperature Control Accuracy | : ±1℃ |
| Temperature Distribution Deviation | : ±1℃ |
| Temperature Control Type | : Industrial PC + PLC |
| Abnormal Alarm | : Temperature abnormal (ultra-high or ultra-low temperature) |
| Dimensions | : 4200x800x1320mm |
| Weight | : 900kg |
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