ETS - X-Ray Machine
Overview
The X-Ray Inspection Equipment is a high-precision, non-destructive inspection system designed to analyze hidden solder joints and internal PCB structures with exceptional clarity. Using advanced 2.5D/3D X-ray imaging, it accurately detects voids, bridging, insufficient solder, and internal cracks in BGAs, QFNs, CSPs, and multilayer PCBs. Equipped with intelligent analysis software, real-time image enhancement, multi-angle viewing, and automated measurement tools, it ensures faster defect identification and reliable process control. Its ergonomic design, strong safety shielding, and user-friendly interface make it ideal for EMS companies, OEMs, R&D labs, and high-reliability sectors like aerospace, EV, medical, and defense electronics.
| Category | Specification |
|---|---|
| Equipment Type | : Offline 2.5D X-Ray Inspection System |
| Application | : BGA, QFN, CSP, PTH, Solder Joint & Void Analysis |
| Inspection Mode | : 2D / 2.5D (Tilt ±60°) |
| Sample Type | : PCB, Semiconductor, Mechanical Parts |
| X-Ray Tube Type | : Closed Microfocus Tube |
| Tube Voltage | : 90–130 kV (Depending on model) |
| Tube Power | : 5–10 W |
| Minimum Focus Spot | : 3–5 μm |
| Power Supply | : AC 220V, 50/60 Hz |
| Power Consumption | : 1–2 kW |
| Max. Loading Area / Weight | : 520 × 420 mm / 10 kg |
| Max. Inspection Area | : 460 × 400 mm |
| Tilting Angle | : ±30° |
| Manipulator | : 5-axis (X / Y / Z1 / Z2 / T) |
| Monitor | : 24’’ FHD LCD Display |
| System OS | : Windows 10 (64-bit) |
| Hard Disk | : 1 TB |
| RAM | : 8 GB |
| CPU Model | : Intel i7 Processor |

Plot No: 32, P.M.R Layout, 5th Street,Block - B,
Deepa Mill Road, Goldwins, Civil Aerodrome Post,
Coimbatore - 641014, Tamil Nadu, India.