Overview

The RFO 835 is a high-performance reflow soldering system designed for medium- to large-scale SMT production. It features 8 temperature zones (4 upper and 4 lower) using a hot-air heating method with frequency conversion air supply, ensuring stable and uniform thermal distribution across PCBs. The machine includes 3 ventilation cooling zones for effective controlled cooling. It supports a large variety of PCB sizes, with a 450 mm net belt width, 300 mm rail width, and an allowed PCB width of up to 350 mm, with no limit on PCB length. The mesh belt allows up to 50 mm PCB width, and the guide rail design supports PCB heights of 25 mm above or below the PCB. The net band height from the ground is 880 ± 20 mm, and the guide height is 900 ± 20 mm. Transport speed ranges from 160 to 1350 mm/min, regulated through a digital display speed controller, with a transport direction of Left → Right. The system includes automatic chain lubrication (timing drip system) for smooth operation. The SMT 835 operates on AC 380V ±10%, 50 Hz, with a starting power of 15 kW and operating power of 3 kW, taking about 25 minutes to reach working temperature. It can process PCBs through the heating zones in 3.5 to 5.5 minutes, and its temperature control range spans from room temperature up to 400°C, regulated precisely using PID closed-loop control. With an outline size of L2720 × W820 × H1360 mm and a weight of 450 kg, the SMT 835 reflow oven delivers reliable, high-capacity performance suitable for modern electronic manufacturing environments.