REFLOW OVEN
"Where Heat Meets Precision — Creating Flawless Solder Joints."
ETS - Top 3 Zone & Bottom 3 Zone Reflow Oven
ETS - Top 3 Zone & Bottom 3 Zone Reflow Oven
Overview
The RFO 630 is a compact and efficient hot-air reflow oven designed for high-precision SMT soldering applications. It features 6 heating zones and 2 cooling zones to ensure stable temperature profiles and consistent soldering quality. With a 1060 mm heating tunnel, 300 mm conveyor width, and PCB capacity up to 280 × 280 mm, it supports a wide range of SMT assemblies. The oven heats up rapidly within 20 minutes and operates efficiently with 9 kW starting power and 3 kW operating power, providing reliable, uniform, and repeatable soldering performance for modern electronics manufacturing.
- 6 Heating Zones (3 Top + 3 Bottom) for precise temperature profiling and stable reflow performance.
- 2 Ventilation Cooling Zones ensuring controlled and uniform cooling of solder joints.
- Hot Air Convection Heating providing even heat distribution across the entire PCB surface.
- Wide Conveyor (300 mm) suitable for most small and medium-sized PCB assemblies.
- Supports PCB size up to 280 × 280 mm, ideal for standard SMT applications.
- Compact and Space-Efficient Design, suitable for small and medium production environments.
- User-friendly operation panel for easy setup and control.
| Category | Specification |
|---|---|
| Number of heating zones | : 6 Zones (Up 3 and Low 3) |
| Heating method | : Hot Air |
| Number of cooling zones | : 2 Ventilation Cooling |
| Length of heating zones | : 1060 mm |
| Width of net belt | : 300 mm |
| PCB dimension | : MAX 280x280 mm |
| Height of net belt | : 880±20 mm |
| Transport Speed of Net Belt | : 0-1350 mm/min (Variable frequency Drive) |
| Transport Direction of Net Belt | : Left-Right (Right-Left) |
| Input Power | : 220V or 380V |
| Starting power | : 9KW |
| Operating Power | : 3KW |
| Heating uptime | : About 20 minutes |
| Time of Passing Through the Machine | : 3.5-5.5 min |
