AUTOMATED OPTICAL
INSPECTION
"Inspect with Intelligence. Quality is Never an Accident."
ETS - 3D Online AOI
ETS - 3D Online AOI
Overview
The 3D AOI is an advanced, high-precision optical and 3D inspection platform designed for SMT and PCB manufacturing. It supports inspection after stencil printing, before/after reflow, before/after wave soldering, and FPC applications. With manual/auto programming and CAD data import, it detects a wide range of defects in solder printing, components, and solder joints using 3D cloud-point reconstruction, AI deep learning, and multi-channel colour imaging. Equipped with a 12-megapixel high-speed camera, customizable high-resolution lenses, and a 4-DLP 3D module, it provides accurate height measurement up to 20 mm with ±10 μm precision. The system offers full-coverage PCB inspection, SPC data analysis, angle support up to 359°, and compatibility with components as small as 01005 and 0.3-pitch ICs. Its automated mechanical system handles PCBs from 50×50 mm to 510×510 mm with high-speed XY servo motion and ≤8 μm positioning accuracy. Designed for seamless SMT line integration, it features SMEMA compatibility, CE-certified safety, and optional MES connectivity, making it ideal for ensuring consistent quality and production reliability.
- Supports post-stencil printing, pre/post reflow, pre/post wave soldering, and FPC inspection.
- Uses 3D cloud-point reconstruction, AI deep learning, multi-channel color imaging, OCV/OCR, and grayscale analysis.
- 12-megapixel high-speed industrial camera with customizable high-resolution lenses (10–25 µm).
- Detects solder insufficiency/excess, bridging, stains, scratches, missing components, misalignment, reverse mounting, wrong parts, solder balls, IC defects, and copper stains.
- Supports 01005 components, 0.3-pitch ICs, and full PCB coverage with array and bad-mark handling.
- Manual programming, auto programming, and CAD data import.
- Automated PCB loading, adjustable track width, and XY servo motion with ≤8 µm positioning accuracy and up to 830 mm/s speed.
- Accepts PCB sizes from 50×50 mm to 510×510 mm, thickness 0.3–5.0 mm.
- Records all inspection data for production quality tracking and optimization.
- CE safety certified, stable performance, ideal for continuous high-volume SMT production.
Inspection System
| Parameter | Details |
|---|---|
| Application | : After stencil printing, pre/post reflow oven, pre/post wave soldering, FPC etc. |
| Program mode | : Manual programming, auto programming, CAD data importing |
| Inspection Items | : Stencil printing: solder unavailability, insufficient or excessive solder, misalignment, etc. Component defect: Missing or excessive component misalignment, wrong or defect part, edging, opposite mounting, wrong or bad component etc. Soldering defect: Excessive or missing solder, empty soldering, bridging, solder ball, N.G.copper stain etc. 3D measure: Height or depth of visible objects (within a range of 20mm), length or width or area of objects within a specified height range. |
| Calculation Method | : 3D cloud point restructure, AI deep learning, colour calculation, colour extraction, Gray scale operation, image contrast, OCR/OCR etc. |
| Inspection mode | : PCB fully covered, with array and bad mark function |
| SPC statistics function | : Fully recorded raw data with flexible analysis for production quality control |
| Component Angle | : Support 0°-359° rotation, minimum angle distance 1° |
| Minimum component | : 01005 chip, 0.3 pitch IC |
Optical System
| Parameter | Details |
|---|---|
| Camera | : Full color high speed industrial digital camera, 1.2-million-pixel camera |
| Lens resolution | : 10µm/15µm/18µm/20µm/25µm, can be customized |
| Lighting source | : Annular stereo multi-channel color light,RGB/RGBW/RGBR/RWB; optional top axial light |
3D Module
| Parameter | Details |
|---|---|
| DLP QTY | : 4 DLP |
| Work Angle | : 30 (depending on DLP used) |
| Height Range | : 20mm (varies by detection requirements) |
| Height Accuracy | : ±1µm |
Computer System
| Parameter | Details |
|---|---|
| OS | : Windows 10, 64bit |
| Monitor | : 22 inch, 16:10 |
| VGA | : Built-in graphic card (or optional discrete GPU) |
| CPU | : Intel i7 series or same level |
| GPU | : Standard |
| RAM | : 64GB |
| HDD | : 1TB (SSD optional) |
| Language | : Chinese and English |
Software
| Parameter | Details |
|---|---|
| Access right control | : Administrator/programmer/operator three-level authority |
Mechanical System
| Parameter | Details |
|---|---|
| Moving & inspection | : Automatic PCB in/out, L→R / R→L direction optional; stepper motor drives camera track movement |
| Track adjustment | : Automatic |
| PCB fixed mode | : Automatic fixture |
| PCB dimension | : 50x50mm (min)-510x510mm (max), Customizable |
| PCB thickness | : 0.3-5.0mm |
| PCB weight | : Max 3kg |
| PCB edge | : 3mm (customizable) |
| PCB bending | : < 5mm or 3% of PCB diagonal length |
| PCB component height | : Top: 35mm, Bottom: 35mm (customizable) |
| XY driving system | : AC servo motor, precise ball screw |
| XY moving speed | : Max: 830mm/s |
| XY positioning accuracy | : ≤8µm |
General Parameters
| Parameter | Details |
|---|---|
| Machine dimension | : L1430xW1250xH1600 mm |
| Power | : AC220V, 50/60Hz, 1.5KW |
| PCB height from ground | : 900 ± 20mm |
| Machine weight | : 1500kg |
| Communication | : SMEMA |
| Production line | : 0.4-0.8 MPa air pressure required |
| Safety standard | : CE safety standard |
| Environment temperature | : 10 - 35℃, 35% - 80% RH (non-condensing) |
