Overview

The RFO 1235 is a high-capacity reflow soldering oven designed for advanced SMT production lines that require precise thermal control and high throughput. It features 12 heating zones—6 upper and 6 lower—using a hot-air heating method supported by frequency conversion air supply, ensuring superior temperature uniformity across the entire PCB surface. The oven is equipped with 3 ventilation cooling zones, allowing controlled and stable cooling after the soldering process. With a 2060 mm long heating zone, 450 mm mesh belt width, and 300 mm rail width, the SMT 1235 supports a wide range of PCB sizes, up to 350 mm in width and unlimited length. The mesh belt supports PCBs up to 50 mm wide, while the guide rail accommodates PCB heights of 25 mm above and below the board. The conveyor height is adjustable, with the net band positioned at 880 ± 20 mm above the ground and the guide rail at 900 ± 20 mm. Transport speeds range from 160 to 1350 mm/min, controlled through a digital display speed regulation system, with left-to-right PCB movement. The oven also includes a timing automatic drip lubrication system for the chain. Powered by AC 380V ±10%, 50 Hz, the SMT 1235 has a heating-up time of approximately 25 minutes, and PCBs typically pass through the system in 3.5 to 5.5 minutes. The temperature can be precisely controlled from room temperature up to 400°C, using PID closed-loop regulation. Designed for industrial reliability, the SMT 1235 combines high performance, stable operation, and accurate thermal profiling for demanding SMT soldering applications.